MS00500 - SEMI MS5 - Test Method for Wafer Bond Strength Measurements

This Test Method enables the determination of the bond strength between two wafers using micro-chevron test structures. Wafer-wafer bonding is a mainstay for microelectromechanical system (MEMS) and three dimensional stacked integrated circuits (3DS-IC) design and fabrication. MEMS components, such as acceleration sensors, gyroscopes, micropumps, or microvalves that are increasingly found in smart automotive and navigation control systems or in medical devices typically use wafer bonding technologies. Due to being subjected to mechanical stresses, the industrial applications of these components require high mechanical strength, low leakage, and high reliability of the wafer-bonded interface. For a knowledge of the strength determining factors (such as fatigue and stress corrosion) of wafer bonding, for quality control, and for the development of new bonding technologies, a method for determining the strength of such bonds is important to producers and users of MEMS devices, of wafer

PDF] Test Method for Wafer Bond Strength Measurements using Micro

Accessible determination of die-to-wafer bond strength with the

Accessible determination of die-to-wafer bond strength with the

A Standard Method for Measuring Wafer Bond Strength for MEMS

Micro-cantilever bending tests for understanding size effect in

A Critical Review of MIL-STD-883 Wirebond Visual Inspection

Accessible determination of die-to-wafer bond strength with the

PDF] Test Method for Wafer Bond Strength Measurements using Micro

Accessible determination of die-to-wafer bond strength with the

Hanatek Variable Force Precision Thickness Gauge (FT3-V

A Standard Method for Measuring Wafer Bond Strength for MEMS

Hanatek Variable Force Precision Thickness Gauge (FT3-V